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400MHz to 2.5GHz, Low-Noise,
SiGe Downconverter Mixers
Table 3. IFOUT Port Impedance
Power-Supply Layout
To minimize coupling between different sections of the
PART
MAX2680
MAX2681
MAX2682
45MHz
960-j372
934-j373
670-j216
FREQUENCY
70MHz
803-j785
746-j526
578-j299
240MHz
186-j397
161-j375
175-j296
IC, the ideal power-supply layout is a star configuration
with a large decoupling capacitor at a central V CC
node. The V CC traces branch out from this central
node, each going to a separate V CC node on the PC
board. At the end of each trace is a bypass capacitor
that has low ESR at the RF frequency of operation. This
arrangement provides local decoupling at the V CC pin.
At high frequencies, any signal leaking out of one sup-
ply pin sees a relatively high impedance (formed by the
Table 4. IF Output Impedance-Matching
Components
V CC trace inductance) to the central V CC node, and an
even higher impedance to any other supply pin, as well
as a low impedance to ground through the bypass
MATCHING
COMPONENT
L1
45MHz
390nH
FREQUENCY
70MHz
330nH
240MHz
82nH
capacitor.
Impedance-Matching Network Layout
The RFIN and IFOUT impedance-matching networks are
very sensitive to layout-related parasitics. To minimize
parasitic inductance, keep all traces short and place
C2
R1
39pF
250 ?
15pF
Open
3pF
Open
components as close as possible to the chip. To mini-
mize parasitic capacitance, use cutouts in the ground
plane (and any other plane) below the matching network
components. However, avoid cutouts that are larger
than necessary since they act as aperture antennas.
Typical Operating Circuit
C1
LO
INPUT
1
LO
SHDN
6
SHUTDOWN
CONTROL
C3
MAX2680
MAX2681
2
GND
MAX2682
V CC
5
V CC
+2.7V TO +5.5V
C4
C5
L1
R1
1000pF
10 μ F
RF
INPUT
Z 1
Z 2
3
RFIN
IFOUT
4
IF
OUTPUT
Z 3
C2
THE VALUES OF MATCHING COMPONENTS C2, L1, R1, Z1, Z2, AND Z3 DEPEND ON THE IF AND RF FREQUENCY AND DOWNCONVERTER. SEE TABLES 2 AND 4.
10
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